Intel® Server System D50DNP1MFALLC Add To Compare
D50DNP1MFALLC Specifications
Essentials
| Product Collection | Intel® Server D50DNP Family |
| Code Name | Products formerly Denali Pass |
| Launch Date | Q1'24 |
| Marketing Status | Launched |
| Limited 3-year Warranty | Yes |
| Extended Warranty Available for Purchase (Select Countries) | Yes |
| Chassis Form Factor | 2U Front IO, 4 node Rack |
| Chassis Dimensions | 597.7 x 437.1 x 40.6 mm (L x W x H) |
| Board Form Factor | 8.33" x 21.5" |
| Rack Rails Included | Yes |
| Compatible Product Series | 4th and 5th Generation Intel® Xeon® Scalable Processors |
| Socket | Socket-E LGA4677 |
| TDP | 350 W |
| Heat Sink | (1) – D50DNP accelerator module liquid-cooling loop – iPC DNPLCLPAM, (1) – D50DNP compute module liquid-cooling loop – iPC DNPLCLPCM |
| Heat Sink Included | Yes |
| System Board | Intel® Server Board D50DNP1SB |
| Board Chipset | Intel® C741 Chipset |
| Target Market | High Performance Computing, Scalable Performance |
| Rack-Friendly Board | Yes |
| Riser Card Included | 1U PCIe MCIO Riser DNP1UMRISER |
| Supported Operating Systems | VMware*, Windows Server 2022*, Windows Server 2019*, Red Hat Linux*, SUSE Linux*, Ubuntu*, CentOS* |
| Included Items | (1) – 1U full-width module tray – iPN M62560 -xxx, (1) – 1U low-profile PCIe MCIO riser card – iPC DNP1UMRISER, (1) – 1U low-profile PCIe standard riser card – iPC DNP1URISER, (1) – Accelerator module liquid-cooling loop – iPC DNPLCLPAM, (1) – carrier baseboard (CBB) – iPC DNPLCPVCCBB, (1) – Compute module liquid-cooling loop – iPC DNPLCLPCM, (1) – Intel® Server Board D50DNP1SB – iPC D50DNP1SB, (1) – MCIO cable for 1U left riser – iPN M40563-xxx, (1) – MCIO cable from P0_PE1 connector to CBB – iPN M82313 -xxx, (1) – MCIO cable from P0_PE2 connector to CBB – iPN M82304 -xxx, (1) – MCIO cable from P1_PE0 connector to CBB – iPN M82302 -xxx, (1) – MCIO cable from P1_PE3 connector to CBB – iPN M82316 -xxx, (1) – Power cable from 12 V to 48 V converter to CBB – iPN M52679 -xxx, (1) – Power cable from 12 V to 48 V converter to CBB – iPN M52680 -xxx, (1) – Signal cable from J_MISC connector to CBB – iPN M82334 -xxx, (2) – 1U riser bracket to support riser cards DNP1URISER and DNP1UMRISER – iPN M44890-xxx |
Supplemental Information
| Description | Density-optimized 1U liquid-cooled compute module designed for HPC and AI application. Supports two 4th or 5th Gen Intel® Xeon® Scalable or Intel® Xeon® CPU Max Series processors with 16 DDR5 DIMMs and up to four Intel® Data Center GPU Max Series modules. |
Memory & Storage
Expansion Options
| PCI Express Revision | 5.0 |
| Riser Slot 1: Total # of Lanes | 24 |
| Riser Slot 2: Total # of Lanes | 24 |
I/O Specifications
Package Specifications
| Max CPU Configuration | 2 |
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
"Announced" SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
"Announced" SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
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