Intel® Server System M50FCP2UR208 Add To Compare
M50FCP2UR208 Specifications
Essentials
| Product Collection | Intel® Server M50FCP Family |
| Code Name | Products formerly Fox Creek Pass |
| Launch Date | Q1'24 |
| Marketing Status | Launched |
| Limited 3-year Warranty | Yes |
| Extended Warranty Available for Purchase (Select Countries) | Yes |
| Chassis Form Factor | 2U Rack |
| Chassis Dimensions | 770 x 438 x 87 mm |
| Board Form Factor | 18.79" x 16.84" |
| Rack Rails Included | No |
| Compatible Product Series | 4th and 5th Generation Intel® Xeon® Scalable Processors |
| Socket | Socket-E LGA4677 |
| TDP | 350 W |
| Heat Sink Included | No |
| System Board | Intel® Server Board M50FCP2SBSTD |
| Board Chipset | Intel® C741 Chipset |
| Rack-Friendly Board | Yes |
| Power Supply | 2100 W |
| Power Supply Type | AC |
| # of Power Supply Included | 0 |
| Redundant Fans | Yes |
| Redundant Power Supported | Yes |
| Backplanes | Included |
| Included Items | (1) – 2U 2.5" Chassis – iPN M36826-xxx, (1) – Front Panel (left) USB cable – iPN K67061-xxx, (1) – Front panel (left) with two USB ports – iPN K48177-xxx, (1) – Front panel (right) cable pin – iPN K67059-xxx, (1) – Front panel (right) with control panel – iPN K48178-xxx, (1) – Server board – iPC M50FCP2SBSTD, (1) – Standard 2U air duct (for 2U-Tall HS) – iPC FCPDUCTSTD, (1) 8 x 2.5" combo HSBP – iPC CYPHSBP2208, (1) I2C cable, server board to HSBP– iPN K63232-xxx, (1) power cable, for 3x HSBPs – iPN K62572-xxx, (16) – DIMM blanks – iPN M45676-xxx, (2) - E1B (MCC) processor clips - iPN AXXSPRMCCCC, (2) – E1A (XCC) processor clips – iPN AXXSPRXCCCC, (2) – Intel® RAID Maintenance Free Backup Unit (RMFBU) bracket, (2) – Riser card assembly brackets, (6) – Single-rotor system fans – iPC CYPFAN2UKIT, (8) 2.5" drive blanks – iPN K71491-xxx, (8) 2.5" SSD mounting rails with lever – iPN K71493-xxx, NOTE: NO PSU included |
Supplemental Information
| Description | Integrated 2U system featuring an Intel® Server Board M50FCP2SBSTD, supporting two 4th or 5th Generation Intel® Xeon® Scalable processors, up to (24) 2.5" SSD with air cooling., NOTE: NO PSU included |
Memory & Storage
| Memory Types | 3DS-RDIMM, 9x4 RDIMM, DDR5 (RDIMM) |
| Max # of DIMMs | 32 |
| Max Memory Size (dependent on memory type) | 12 TB |
| # of Front Drives Supported | 24 |
| Intel® Optane™ Persistent Memory Supported | No |
Expansion Options
| PCI Express Revision | 5.0 |
| Riser Slot 1: Total # of Lanes | 32 |
| Riser Slot 2: Total # of Lanes | 32 |
| Riser Slot 3: Total # of Lanes | 16 |
I/O Specifications
Package Specifications
| Max CPU Configuration | 2 |
Advanced Technologies
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
"Announced" SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
"Announced" SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
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