Intel® Server D50TNP Family (Tennessee Pass)

Density Optimized Solution Offering New Expanded Options and Performance for HPC and AI

Fueled by 3rd Gen Intel® Xeon® Scalable processors, the Intel® Server System D50TNP Family delivers performance optimized for density in HPC and AI applications, while also broadening the scope of available solutions. With four distinct module types offering specialized features for compute, management, storage, and accelerator functionality, this system is engineered for flexible scalability, tailored to meet your exact requirements.

 
 

Intel Server D50TNP Family : 6

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Multi Node Servers - D50TNP2MHSVAC

D50TNP2MHSVAC

2U Half-Width Management Module with High-flow Air Cooling

  • Up to 270W 2S 3rd Gen Intel® Xeon® Scalable processors
  • 8+8 DDR4 DIMMs @ 3200 MT/s
  • 3 x16 and 1 x8 PCIe 4.0 low-profile(LP) slots
  • 2 M.2 SATA/NVMe SSDs 80 or 110 mm and 2 U.2 NVMe
  • 1 10GBase-T LAN and 1 1000Base-T dedicated IPMI ports
  • 2U 2 nodes, High-flow air cooling
  • 3 1600W (80+ Titanium)/ 2100W (80+ Platinum) CRPS PSUs
   
Multi Node Servers - D50TNP2MHSTAC

D50TNP2MHSTAC

2U Half-Width Storage Module with High-flow Air Cooling

  • Up to 205W 2S 3rd Gen Intel® Xeon® Scalable processors
  • 8+8 DDR4 DIMMs @ 3200 MT/s
  • 2 x16 PCIe 4.0 low-profile (LP) slots
  • 2 M.2 SATA/NVMe SSDs 80 or 110 mm and 16 E1.L NVMe
  • 1 10GBase-T LAN and 1 1000Base-T dedicated IPMI ports
  • 2U 2 nodes, High-flow air cooling
  • 3 1600W (Titanium)/ 2100W (Platinum) CRPS PSUs
   
Multi Node Servers - D50TNP1MHCRAC

D50TNP1MHCRAC

1U Half-Width Compute Module with High-flow Air Cooling

  • Up to 205W 2S 3rd Gen Intel® Xeon® Scalable processors
  • 8+8 DDR4 DIMMs @ 3200 MT/s
  • 2 x16 PCIe 4.0 low-profile (LP) slots
  • 2 M.2 SATA/NVMe SSDs 80 or 110 mm
  • 1 10GBase-T LAN and 1 1000Base-T dedicated IPMI ports
  • 2U 4 nodes, High-flow air cooling
  • 3 hot-swap CRPS 2100W (80+ Platinum) PSUs
   
Multi Node Servers - D50TNP2MFALAC

D50TNP2MFALAC

2U Full-Width Acceleration Module with High-flow Air Cooling

  • Up to 270W 2S 3rd Gen Intel® Xeon® Scalable processors
  • 8+8 DDR4 DIMMs @ 3200 MT/s
  • 3 x16 and 1 x8 PCIe 4.0 LP + 4 x14 FHFL DW PCIe 4.0 slots
  • 2 M.2 SATA/NVMe SSDs 80 or 110 mm and 2 U.2 NVMe
  • 1 10GBase-T LAN and 1 1000Base-T dedicated IPMI ports
  • 2U 1 node, High-flow air cooling
  • 3 1600W CRPS PSUs
   
Multi Node Servers - D50TNP1MHCRLC

D50TNP1MHCRLC

1U Half-Width Compute Module with Direct-to-Chip Liquid Cooling

  • Up to 270W 2S 3rd Gen Intel® Xeon® Scalable processors
  • 8+8 DDR4 DIMMs @ 3200 MT/s
  • 2 x16 PCIe 4.0 low-profile (LP) slots
  • 2 M.2 SATA/NVMe SSDs 80 or 110 mm
  • 1 10GBase-T LAN and 1 1000Base-T dedicated IPMI ports
  • 2U 4 nodes, Direct-to-chip liquid-cooled
  • 3 2100W CRPS PSUs (80+ Platinum)
   
Multi Node Servers - D50TNP1MHCPAC

D50TNP1MHCPAC

1U Half-Width Compute Module with High-flow Air Cooling

  • Up to 205W 2S 3rd Gen Intel® Xeon® Scalable processors
  • 8+8 DDR4 DIMMs @ 3200 MT/s
  • 2 x16 PCIe 4.0 low-profile (LP) slots
  • 2 M.2 SATA/NVMe SSDs 80 or 110 mm
  • 1 10GBase-T LAN and 1 1000Base-T dedicated IPMI ports
  • 2U 4 nodes, High-flow air cooling
  • 3 hot-swap CRPS 2100W (80+ Platinum) PSUs
   
 

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